Test Device Fail Rockchip Batch Tool

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ISO Numerical Code
new arrivals
solid cbn inserts
solid corner
pcbn turning inserts
tipped pcbn inserts

Insert Shape C
(80° diamond)

CCGW/CCMW0602
CCGW/CCMW09T3
CCGW/CCMW1204
CPGW/CPMW0602
CPGW/CPMW09T3
CNGA/CNMA1204
CNGN/CNMN1204

Insert Shape D
(55° diamond)

DCGW/DCMW0702
DCGW/DCMW11T3
DPGW/DPMW0702
DPGW/DPMW11T3
DNGA/DNMA1104
DNGA/DNMA1506
DNGA/DNMA1504

Insert Shape T
(60° triangle)

TCGW/TCMW0902
TCGW/TCMW1102
TCGW/TCMW1103
TCGW/TCMW16T3
TPGW/TPMW0902
TPGW/TPMW1103
TPGW/TPMW16T3
TPGN/TPMN1103
TPGN/TPMN1603
TNGA/TNMA1103
TNGA/TNMA1604

Insert Shape V
(35° diamond)

VBGW/VBMW1604
VCGW/VCMW1103
VNGA/VNMA1604

Insert Shape S
(90° square)

SCGW/SCMW09T3
SCGW/SCMW1204
SPGN/SPMN1204
SNGA/SNMA0903
SNGA/SNMA1204
SNGN/SNMN0903
SNGN/SNMN1204

Insert Shape W
(80° hexagon)

WCGW/WCMW0402
WCGT/WCMT06T3
WNGA/WNMA0604
WNGA/WNMA0804

pcbn is the second hardest material in the world, and cbn related high precision cutting tools are introduced to industry, achieved high productivity and cost reductions. pcbn is the short name of polycrystalline cubic boron nitride, and pcbn inserts are mainly for the hard metal turning to replace the conventional machining way of grinding. We manufacture pcbn inserts for advanced material processes and technologies, with a set of knowledgeable employees and extensive manufacturing facilities, we are ready to serve the needs of our esteemed customers. Our highest selling products include solid cbn inserts, cbn cutting tools, cbn turning inserts, indexable cutting tool inserts, cnc cutting inserts, cbn machining inserts and cbn tooling inserts, just to name a few.

80°
Diamond		55°
Diamond		55°
Parallelogram 		RoundSquareTriangle35°
Diamond		80°
Hexagon

polycrystalline cubic boron nitride is an optimal material to cut ferrous metals, because pcbn is thermally stable up to approximately 1200℃ and has high resistance to chemical attack, so when pcbn inserts occur extreme temperatures for machining hard ferrous metals, it performed perfectly and can be used to promote self-induced hot cutting, so pcbn inserts are widely used for iron based alloy machining such as cast iron and hardened steel. We have three main types of cbn inserts in supply, they are solid cbn inserts, solid corner cbn inserts and tipped cbn inserts from continuous turning to heavy interrupted turning.

Solid CBN inserts, solid pcbn inserts for hard metal turning

Nowadays, the acceptance of using solid cbn inserts is becoming widespread all around the globe. As they are almost indestructible and made by purely cubic boron nitride, they possess a matchless capacity of heat absorption and you can use them at highest temperatures without any hassle. They are being utilized for multifarious purposes such as for turning hardened steel, nodular cast iron, grey cast iron, carbon steel, powdered metals, and work parts of automobile brake discs, aircraft jet engines, roller, bearing, pumps. The best part of solid cbn inserts is that the cost is minimized around 5 – 6 percent of the total machining cost. What’s more! The solid cbn inserts also provide the best in performance and hardness. With such a super high wear resistance, high processing precision, long service life, and affordable price, the solid cbn inserts are gradually grabbing the global marketplace.

CNMN solid cbn insertRNMN solid cbn insertSNMN solid cbn insertTNGN solid cbn insert
DNUN solid cbn insertRCMX solid cbn insertRCMX solid cbn insertWNMN solid cbn insert

These methodically brazed inserts are solid-corner inserts, the insert blanks can be availed with pin-lock holes especially for clamping on toolbars or tool holders. Solid corner pcbn inserts have a base of tungsten carbide and cutting edges act as working tips. These are a sold alternate to cbn inserts used for hard-metal machining when clamping holes needed. They have the capability with superior solder ability as well as good resistance to the soldering heat. As a result, the impactful resistance of thoroughly brazed inserts is of high quality. They are generally used for interrupted machining. The double tips present in these inserts act as two working tips across both sides, thus increasing the overall efficiency. We have been consistently manufacturing the best quality cbn inserts for our clients.

CNGA thoroughly brazed solid corner pcbn turning insertWNGA thoroughly brazed solid corner pcbn turning insertSNGA thoroughly brazed solid corner pcbn turning insertTNGA thoroughly brazed solid corner pcbn turning insert
CCGW solid corner cbn turning insertsDNGA solid corner cbn turning insertsVNGA solid corner cbn turning insertsTCGW solid corner cbn turning inserts

Tipped pcbn turning inserts, polycrystalline cBN tipped inserts

CBN tipped inserts have gained competitive advantage due to their cost-effective pricing. We manufacture high quality cbn tipped inserts in accordance with the national as well as international standards. Cbn inserts help in improving the productivity of the machining process; ensuring that the life of the tool is optimum as well as enhancing the overall surface finishes for faster completion of work. Another advantage of these inserts is that they can be used from both sides. Thus, if one side is degraded or worn out, the customer can use the other.

CCGW/CCMW0602
CCGW/CCMW09T3
CCGW/CCMW1204		CPGW/CPMW0602
CPGW/CPMW09T3		CNGA/CNMA1204CNGN/CNMN1204
DCGW/DCMW0702
DCGW/DCMW11T3		DPGW/DPMW0702
DPGW/DPMW11T3		DNGA/DNMA1104
DNGA/DNMA1506
DNGA/DNMA1504
TCGW/TCMW0902
TCGW/TCMW1102
TCGW/TCMW1103
TCGW/TCMW16T3		TPGW/TPMW0902
TPGW/TPMW1103
TPGW/TPMW16T3		TNGA/TNMA1103
TNGA/TNMA1604		TPGN/TPMN1103
TPGN/TPMN1603
VBGW/VBMW1604VCGW/VCMW1103VNGA/VNMA1604
SCGW/SCMW09T3
SCGW/SCMW1204		SPGN/SPMN1204SNGA/SNMA0903
SNGA/SNMA1204		SNGN/SNMN0903
SNGN/SNMN1204
WCGW/WCMW0402WCGT/WCMT06T3WNGA/WNMA0604
WNGA/WNMA0804

These cbn inserts are generally applied for machining hardened steel and even a few steels with high alloy content. It is to be noted here that the aluminium alloys cannot be machined with cbn inserts because the aluminium builds up on the cutting edge instantaneously which triggers wear and poor surface finish in return, pcd inserts are more suitable for cutting these non-ferrous aluminum alloys.

The new advances in the designs of pcbn cutting tools have received overmuch accolades from across the globe due to both enhanced performance and its usage on a broad range of applications. You can use the pcbn to machine parts with a lower hardness but it is not recommended because they are mostly suggested to be applied to the work pieces with a 45 Rockwell C hardness rating. The pcbn inserts are very feasible and dependable for a broad range of roughing and finishing applications.

Test Device Fail Rockchip Batch Tool 1 8

Rockchip batch tool
HOMEAbout usPCBN insertPCD insertSite mapContact usTechnical FAQ

Run Batch tool or Android tool on your host PC. In order to connect device with Host PC and run bootloader mode you should perform following steps: 1. Plug off device power adaptor. Connect device to computer via usb OTG port, much better to use certified OTG USB cable from package. Run Batch tool or RK Android tool. Best free data recovery software: This tutorial is aimed at all those who own a Android TV box fitted with a Rockchip processor. After circuit and attaching to host PC, Android tool will show you message in progress bar: Found one maskrom device. Then start upgrade. The reflashing process should run several steps. You also can use Batch tool for this action. Device indication should turn blue instead of green for maskrom mode. RockChip Batch Tool (all versions) where can i buy Ivermectin RockChip Batch Tool is a small tool made by Fuzhou Rockchip that allows you to flash IMG firmware on the RockChipset devices (RK2918, RK3066, RK3188). Here, on this page, we have managed to share the latest and oldest version of. Take A Sneak Peak At The Movies Coming Out This Week (8/12) Watching Zoolander With My Teenage Brother, 20 Years After Its Release; Watching ‘Dear Evan Hansen’ in a Movie Theater Near Me.

But if your mac is not supported by macOS mojave then you can download macOS high sierra from these download links. Macos mojave patcher tool. Can windows 10 open files.Now in 2018 as macOS Mojave is released I would highly recommend you to install macOS Mojave on your mac because it contains many bug fixes, new features and also apfs file system is more stable as compared to macOS high sierra. Can i netflix to my mac.This article contains links which can be installed on a real mac as well as can be used to build a Hackintosh.

Test device fail rockchip batch tool code

Rockchip Batch Tool

Rockchip

PCD insert

CCGW/CCMW0602CCGW/CCMW09T3CCGW/CCMW1204CPGW/CPMW0602CPGW/CPMW09T3CPGT/CPMT09T3
CCGT/CCMT0602CCGT/CCMT09T3CCGT/CCMT1204CPGT/CPMT0602
DCGW/DCMW0702DCGW/DCMW11T3DPGW/DPMW0702DPGT/DPMT0702DPGW/DPMW11T3DPGT/DPMT11T3
DCGT/DCMT0702DCGT/DCMT11T3
TCGW/TCMW0902TCGW/TCMW1102TCGW/TCMW16T3TPGW/TPMW0902TPGT/TPMT0902TPGX/TPMX1103
TCGT/TCMT0902TCGT/TCMT1102TCGT/TCMT16T3
VBGW/VBMW1604VBGT/VBMT1604VCGW/VCMW1103VCGT/VCMT1103VCGW/VCMW1604VCGT/VCMT1604
WCGW/WCMW0402WCGT/WCMT0402WCGW/WCMW06T3WCGT/WCMT06T3

PCD insert

We export PCBN insert to world wide countries, such as USA united states, Germany, UK united kingdom, Italy, France, Turkey, Russia, Saudi Arabia, United Arab Emirates, Ukraine, Israel, Canada, South Africa, South Korea, Japan, Australia, New Zealand, Finland, Sweden, Norway, Danmark, Switzerland, Poland, Czech,Ireland, Holand, Belgium, Greece, Croatia, Spain, Portugal, Egypt, India, Philippines, Cambodia, Thailand, Malaysia, Singapore, Indonesia, Mexico, Brazil, Colombia, Chile, Argentina etc.

Contact: RichardTel: +0086-13929967797E-mail: sales@pcd-insert.com

Rockchip Flash Tool

Here is a Brief Log:
19:21:12 771 Rockchip Batch Tool v1.5.3.0 start run
19:27:42 940 **********Upgrade Start Total<1>**********
19:27:42 945 <Layer 6-1> Test Device Start
19:27:42 953 <Layer 6-1> Test Device Success
19:27:42 956 <Layer 6-1> Check Chip Start
19:27:42 960 <Layer 6-1> Check Chip Success
19:27:42 963 <Layer 6-1> Get FlashInfo Start
19:27:42 965 <LAYER 6-1> INFO:FlashInfo: 0 0 0 1 0 10 10 28 1E 2 5
19:27:42 967 <Layer 6-1> Get FlashInfo Success
19:27:42 970 <Layer 6-1> Prepare IDB Start
19:27:42 971 <LAYER 6-1> INFO:CS(1) (8192MB) (HYNIX)
19:27:42 972 <LAYER 6-1> INFO:CS(3) (8192MB) (HYNIX)
19:28:01 974 <LAYER 6-1> ERROR:BuildBlockStateMap-->RKU_TestBadBlock failed,RetCode(-4)
19:28:01 975 <LAYER 6-1> ERROR:PrepareIDB-->BuildBlockStateMap failed
19:28:01 982 <Layer 6-1> Prepare IDB Fail
19:28:01 998 **********Upgrade Done Success<0> Fail<1> Time<19064>ms**********
19:28:58 032 **********Restore Start Total<1>**********
19:28:58 036 <Layer 6-1> Test Device Start
19:28:58 042 <Layer 6-1> Test Device Success
19:28:58 045 <Layer 6-1> Lowerformat Device Start
19:29:24 049 <LAYER 6-1> ERROR:LowerFormatDevice-->RKU_TestDeviceReady failed,subCode(0x0),RetCode(-4)
19:29:25 056 <Layer 6-1> Lowerformat Device Success
19:29:25 063 <Layer 6-1> Test Device Start
19:29:25 074 <Layer 6-1> Test Device Success
19:29:25 082 <Layer 6-1> Check Chip Start
19:29:25 088 <Layer 6-1> Check Chip Success
19:29:25 092 <Layer 6-1> Get FlashInfo Start
19:29:25 093 <LAYER 6-1> INFO:FlashInfo: 0 0 0 1 0 10 10 28 1E 2 5
19:29:25 100 <Layer 6-1> Get FlashInfo Success
19:29:25 104 <Layer 6-1> Prepare IDB Start
19:29:25 105 <LAYER 6-1> INFO:CS(1) (8192MB) (HYNIX)
19:29:25 106 <LAYER 6-1> INFO:CS(3) (8192MB) (HYNIX)
19:29:25 115 <Layer 6-1> Prepare IDB Success
19:29:25 118 <Layer 6-1> Download IDB Start
19:29:44 735 <LAYER 6-1> ERROR:WriteIDBlock-->RKU_ReadSector failed,RetCode(-4)
19:30:08 736 <LAYER 6-1> ERROR:WriteIDBlock-->RKU_ReadSector-->RKU_EraseBlock failed,RetCode(-3)
19:30:08 743 <Layer 6-1> Download IDB Fail
19:30:32 747 <LAYER 6-1> ERROR:FindIDBlock-->RKU_ReadSector failed,RetCode(-3)
19:30:56 750 <LAYER 6-1> ERROR:BufferWriteBack-->RKU_EraseBlock failed,Block(5),RetCode(-3)
19:31:20 753 <LAYER 6-1> ERROR:BufferWriteBack-->RKU_EraseBlock failed,Block(6),RetCode(-3)
19:31:44 756 <LAYER 6-1> ERROR:BufferWriteBack-->RKU_EraseBlock failed,Block(7),RetCode(-3)
19:32:08 759 <LAYER 6-1> ERROR:BufferWriteBack-->RKU_EraseBlock failed,Block(8),RetCode(-3)
19:32:32 763 <LAYER 6-1> ERROR:BufferWriteBack-->RKU_EraseBlock failed,Block(9),RetCode(-3)
19:32:32 765 <LAYER 6-1> ERROR:BufferWriteBack failed
19:32:32 771 **********Restore Done Success<0> Fail<1> Time<214736>ms**********
19:35:51 022 **********Restore Start Total<1>**********
19:35:51 033 <Layer 6-1> Test Device Start
19:35:51 038 <Layer 6-1> Test Device Success
19:35:51 042 <Layer 6-1> Lowerformat Device Start
19:36:13 078 <Layer 6-1> Lowerformat Device Success
19:36:13 085 <Layer 6-1> Test Device Start
19:36:13 098 <Layer 6-1> Test Device Success
19:36:13 105 <Layer 6-1> Check Chip Start
19:36:13 113 <Layer 6-1> Check Chip Success
19:36:13 118 <Layer 6-1> Get FlashInfo Start
19:36:13 119 <LAYER 6-1> INFO:FlashInfo: 0 0 0 1 0 10 10 28 1E 2 5
19:36:13 122 <Layer 6-1> Get FlashInfo Success
19:36:13 126 <Layer 6-1> Prepare IDB Start
19:36:13 127 <LAYER 6-1> INFO:CS(1) (8192MB) (HYNIX)
19:36:13 127 <LAYER 6-1> INFO:CS(3) (8192MB) (HYNIX)
19:36:32 135 <LAYER 6-1> ERROR:GetWriteBackData-->RKU_ReadSector failed,RetCode(-4)
19:36:56 139 <LAYER 6-1> ERROR:GetWriteBackData-->RKU_ReadSector failed,RetCode(-3)
19:37:20 142 <LAYER 6-1> ERROR:GetWriteBackData-->RKU_ReadSector failed,RetCode(-3)
19:37:44 145 <LAYER 6-1> ERROR:GetWriteBackData-->RKU_ReadSector failed,RetCode(-3)
19:37:44 152 <Layer 6-1> Prepare IDB Success
19:37:44 164 <Layer 6-1> Download IDB Start
19:38:03 915 <LAYER 6-1> ERROR:WriteIDBlock-->RKU_EraseBlock failed,RetCode(-3)
19:38:27 938 <LAYER 6-1> ERROR:WriteIDBlock-->RKU_EraseBlock failed,RetCode(-3)
19:38:51 965 <LAYER 6-1> ERROR:WriteIDBlock-->RKU_EraseBlock failed,RetCode(-3)
19:39:15 992 <LAYER 6-1> ERROR:WriteIDBlock-->RKU_EraseBlock failed,RetCode(-3)
19:39:40 017 <LAYER 6-1> ERROR:WriteIDBlock-->RKU_EraseBlock failed,RetCode(-3)
19:40:04 041 <LAYER 6-1> ERROR:WriteIDBlock-->RKU_EraseBlock failed,RetCode(-3)
19:40:28 062 <LAYER 6-1> ERROR:WriteIDBlock-->RKU_EraseBlock failed,RetCode(-3)
19:40:52 086 <LAYER 6-1> ERROR:WriteIDBlock-->RKU_EraseBlock failed,RetCode(-3)
19:41:16 112 <LAYER 6-1> ERROR:WriteIDBlock-->RKU_EraseBlock failed,RetCode(-3)
19:41:40 137 <LAYER 6-1> ERROR:WriteIDBlock-->RKU_EraseBlock failed,RetCode(-3)
19:41:40 144 <Layer 6-1> Download IDB Fail
19:42:04 147 <LAYER 6-1> ERROR:FindIDBlock-->RKU_ReadSector failed,RetCode(-3)
19:42:28 149 <LAYER 6-1> ERROR:BufferWriteBack-->RKU_EraseBlock failed,Block(5),RetCode(-3)
19:42:52 150 <LAYER 6-1> ERROR:BufferWriteBack-->RKU_EraseBlock failed,Block(6),RetCode(-3)
19:43:16 151 <LAYER 6-1> ERROR:BufferWriteBack-->RKU_EraseBlock failed,Block(7),RetCode(-3)
19:43:40 153 <LAYER 6-1> ERROR:BufferWriteBack-->RKU_EraseBlock failed,Block(8),RetCode(-3)
19:44:04 155 <LAYER 6-1> ERROR:BufferWriteBack-->RKU_EraseBlock failed,Block(9),RetCode(-3)
19:44:04 156 <LAYER 6-1> ERROR:BufferWriteBack failed
19:44:04 164 **********Restore Done Success<0> Fail<1> Time<493135>ms**********
19:46:54 975 Rockchip Batch Tool v1.5.3.0 start run
19:47:12 260 **********Restore Start Total<1>**********
19:47:12 262 <Layer 6-1> Test Device Start
19:47:12 266 <Layer 6-1> Test Device Success
19:47:12 267 <Layer 6-1> Lowerformat Device Start
19:47:34 294 <Layer 6-1> Lowerformat Device Success
19:47:34 298 <Layer 6-1> Test Device Start
19:47:34 304 <Layer 6-1> Test Device Success
19:47:34 318 <Layer 6-1> Check Chip Start
19:47:34 325 <Layer 6-1> Check Chip Success
19:47:34 328 <Layer 6-1> Get FlashInfo Start
19:47:34 330 <LAYER 6-1> INFO:FlashInfo: 0 0 0 1 0 10 10 28 1E 2 5
19:47:34 332 <Layer 6-1> Get FlashInfo Success
19:47:34 335 <Layer 6-1> Prepare IDB Start
19:47:34 336 <LAYER 6-1> INFO:CS(1) (8192MB) (HYNIX)
19:47:34 337 <LAYER 6-1> INFO:CS(3) (8192MB) (HYNIX)
19:47:34 347 <Layer 6-1> Prepare IDB Success
19:47:34 350 <Layer 6-1> Download IDB Start
19:47:34 914 <Layer 6-1> Download IDB Success
19:47:34 920 <Layer 6-1> Reset Device Start
19:47:35 927 <Layer 6-1> Reset Device Success
19:47:35 937 <Layer 6-1> Wait For Loader Start
19:47:37 128 <Layer 6-1> Wait For Loader Success
19:47:37 131 <Layer 6-1> Test Device Start
19:47:38 164 <Layer 6-1> Test Device Success
19:47:38 170 <Layer 6-1> Download Firmware Start
19:48:02 386 <LAYER 6-1> ERROR:RKA_File_Download-->RKU_WriteLBA failed,Written(0),RetCode(-4)
19:48:02 388 <LAYER 6-1> ERRORownloadImage-->RKA_File_Download failed(kernel)
19:48:02 394 <Layer 6-1> Download Firmware Fail
19:48:02 400 **********Restore Done Success<0> Fail<1> Time<50139>ms**********
19:48:25 842 **********Restore Start Total<1>**********
19:48:25 846 <Layer 6-1> Test Device Start
19:48:48 505 <LAYER 6-1> ERROR:TestDevice-->RKU_TestDeviceReady failed,RetCode(-4)
19:48:49 506 <LAYER 6-1> ERROR:TestDevice-->RKU_TestDeviceReady failed,RetCode(-1)
19:48:50 508 <LAYER 6-1> ERROR:TestDevice-->RKU_TestDeviceReady failed,RetCode(-1)
19:48:51 514 <Layer 6-1> Test Device Fail
19:48:51 521 **********Restore Done Success<0> Fail<1> Time<25678>ms**********
19:49:14 286 **********Restore Start Total<1>**********
19:49:14 290 <Layer 6-1> Test Device Start
19:49:38 294 <LAYER 6-1> ERROR:TestDevice-->RKU_TestDeviceReady failed,RetCode(-4)
19:49:39 298 <Layer 6-1> Test Device Success
19:49:39 301 <Layer 6-1> Lowerformat Device Start
19:50:01 334 <Layer 6-1> Lowerformat Device Success
19:50:01 341 <Layer 6-1> Test Device Start
19:50:01 350 <Layer 6-1> Test Device Success
19:50:01 356 <Layer 6-1> Check Chip Start
19:50:01 360 <Layer 6-1> Check Chip Success
19:50:01 365 <Layer 6-1> Get FlashInfo Start
19:50:01 366 <LAYER 6-1> INFO:FlashInfo: 0 0 0 1 0 10 10 28 1E 2 5
19:50:01 370 <Layer 6-1> Get FlashInfo Success
19:50:01 373 <Layer 6-1> Prepare IDB Start
19:50:01 374 <LAYER 6-1> INFO:CS(1) (8192MB) (HYNIX)
19:50:01 375 <LAYER 6-1> INFO:CS(3) (8192MB) (HYNIX)
19:50:01 384 <Layer 6-1> Prepare IDB Success
19:50:01 389 <Layer 6-1> Download IDB Start
19:50:20 575 <LAYER 6-1> ERROR:WriteIDBlock-->RKU_ReadSector failed,RetCode(-4)
19:50:44 578 <LAYER 6-1> ERROR:WriteIDBlock-->RKU_ReadSector-->RKU_EraseBlock failed,RetCode(-3)
19:50:44 585 <Layer 6-1> Download IDB Fail
20:25:34 218 Rockchip Batch Tool v1.5.3.0 start run
20:25:48 031 **********Restore Start Total<1>**********
20:25:48 036 <Layer 6-1> Test Device Start
20:25:48 040 <Layer 6-1> Test Device Success
20:25:48 042 <Layer 6-1> Lowerformat Device Start
20:26:35 074 <LAYER 6-1> ERROR:LowerFormatDevice-->RKU_TestDeviceReady failed,subCode(0x0),RetCode(-4)
20:26:36 080 <Layer 6-1> Lowerformat Device Success
20:26:36 084 <Layer 6-1> Test Device Start
20:26:36 092 <Layer 6-1> Test Device Success
20:26:36 100 <Layer 6-1> Check Chip Start
20:26:36 104 <Layer 6-1> Check Chip Success
20:26:36 144 <Layer 6-1> Get FlashInfo Start
20:26:36 146 <LAYER 6-1> INFO:FlashInfo: 0 0 0 1 0 10 10 28 1E 2 5
20:26:36 149 <Layer 6-1> Get FlashInfo Success
20:26:36 152 <Layer 6-1> Prepare IDB Start
20:26:36 152 <LAYER 6-1> INFO:CS(1) (8192MB) (HYNIX)
20:26:36 153 <LAYER 6-1> INFO:CS(3) (8192MB) (HYNIX)
20:26:36 163 <Layer 6-1> Prepare IDB Success
20:26:36 166 <Layer 6-1> Download IDB Start
20:26:36 731 <Layer 6-1> Download IDB Success
20:26:36 738 <Layer 6-1> Reset Device Start
20:26:37 744 <Layer 6-1> Reset Device Success
20:26:37 751 <Layer 6-1> Wait For Loader Start
20:26:39 077 <Layer 6-1> Wait For Loader Success
20:26:39 084 <Layer 6-1> Test Device Start
20:26:40 093 <Layer 6-1> Test Device Success
20:26:40 104 <Layer 6-1> Download Firmware Start
20:27:10 276 <LAYER 6-1> ERROR:RKA_File_Download-->RKU_WriteLBA failed,Written(66060288),RetCode(-3)
20:27:10 278 <LAYER 6-1> ERRORownloadImage-->RKA_File_Download failed(system)
20:27:10 285 <Layer 6-1> Download Firmware Fail
20:27:10 292 **********Restore Done Success<0> Fail<1> Time<82259>ms**********
20:27:57 007 **********Restore Start Total<1>**********
20:27:57 011 <Layer 6-1> Test Device Start
20:27:57 017 <Layer 6-1> Test Device Success
20:27:57 020 <Layer 6-1> Lowerformat Device Start
20:28:26 027 <LAYER 6-1> ERROR:LowerFormatDevice-->RKU_TestDeviceReady failed,subCode(0x0),RetCode(-4)
20:28:27 035 <Layer 6-1> Lowerformat Device Success
20:28:27 039 <Layer 6-1> Test Device Start
20:28:27 043 <Layer 6-1> Test Device Success
20:28:27 047 <Layer 6-1> Check Chip Start
20:28:27 051 <Layer 6-1> Check Chip Success
20:28:27 054 <Layer 6-1> Get FlashInfo Start
20:28:27 056 <LAYER 6-1> INFO:FlashInfo: 0 0 0 1 0 10 10 28 1E 2 5
20:28:27 058 <Layer 6-1> Get FlashInfo Success
20:28:27 061 <Layer 6-1> Prepare IDB Start
20:28:27 062 <LAYER 6-1> INFO:CS(1) (8192MB) (HYNIX)
20:28:27 063 <LAYER 6-1> INFO:CS(3) (8192MB) (HYNIX)
20:28:27 072 <Layer 6-1> Prepare IDB Success
20:28:27 075 <Layer 6-1> Download IDB Start
20:28:46 171 <LAYER 6-1> ERROR:WriteIDBlock-->RKU_ReadSector failed,RetCode(-4)
20:29:10 174 <LAYER 6-1> ERROR:WriteIDBlock-->RKU_ReadSector-->RKU_EraseBlock failed,RetCode(-3)
20:29:10 178 <Layer 6-1> Download IDB Fail